- Code
- SilSo Bond 13603 Feature
- Feature 1
- Thixotropic paste
- Feature 2
- Low corrosive
- Feature 3
- Primerless adhesion to many substrates
- Feature 4
- Low odour
- 100% Modulus (N/mm2)
- 0.8 MPa
- Appearance
- Thixotropic paste
- Color
- Translucent
- Cure Profile
- 23+/-2°C and 50+/-5% humidity
- Cure Through to 3 mm Depth
- 12 hr
- Cure Type
- Oxime
- Density
- 1.07 g/cm3
- Dielectric Constant
- 3
- Dielectric Strength (V/mil)
- 457 V/mil
- Dielectric Strength kV/mm
- 32 kV/mm
- Dissipation Factor
- 0.0025
- Elongation at Break
- 300 %
- Extrusion Rate g/min
- 390 g/min
- Hardness Shore A
- 33
- Lap Shear Aluminium kg/cm²
- 4.15 kg/cm²
- Lap Shear Stainless Steel 304 kg/cm²
- 3.52 kg/cm²
- Linear Coefficient of Thermal Expansion (ppm/°C)
- 295 ppm/°C
- Linear Shrinkage (%)
- 0.8 %
- Max Storage Temperature
- 40 °C
- Max Working Temp
- 220 °C
- Min Working Temp
- -50 °C
- Rheology
- Paste
- RTV or Heat cure
- RTV
- Self Bonding
- Yes
- Shelf Life
- 12 mths
- Tack Free Time / Skin Formation at 23°C/73°F
- 5 min
- Tear Resistance (N/mm)
- 4.8 N/mm
- Tensile Strength
- 2.15 N/mm2
- Test Conditions
- 7 days at 23+/-2°C and 50+/-5% humidity
- Thermal Conductivity
- 0.2 W/mK
- Volume Coefficient of Thermal Expansion (ppm/°C)
- 888 ppm/°C
- Volume Resistivity (Ohms cm)
- 8.7E+15 ohms cm
- Youngs Modulus (N/mm2)
- 0.6 N/mm2